Introducing a slimmer, smarter, AirJet® chip for increased performance even in the thinnest electronic devices!
We are excited to kick off the new year at CES2024 with the launch of a new AirJetchip - AirJet Mini Slim - a thinner, lighter, smarter and even more advanced solid-state active cooling chip.
Building on the success of our original AirJet Mini, which garnered widespread recognition around the globe, including the prestigious COMPUTEX 2023 GoldenAward in Taiwan, the Good Design Award in Japan, and CES2024 “Best of Innovation”Award, we are continuing to accelerate the pace of innovation in thermal management.
AirJet®Mini Slim, featuring the same groundbreaking solid-state active cooling design of AirJet Mini, includes three new features, while remaining silent, lightweight and delivering superior heat removal compared to traditional fans.
WHAT'S NEW:
Thinner Design:
At an incredibly thin 2.5mm and weighing only 8g, the AirJet Mini Slim trims an additional 0.3mm from the thickness and 1g from the weight of the originalAirJet Mini, while maintaining the same heat removal capability. This ultra-thin profile opens up new possibilities for manufacturers catering to consumer demand for higher performance in increasingly thinner devices. TheAirJet Mini Slim is an ideal solution for ultra-thin products like fanless laptops, professional tablets, handheld gaming devices, SSD accessories and smartphones.
Intelligent Self-Cleaning:
Addressing an industry-wide challenge, the AirJet Mini Slim introduces intelligent self-cleaning feature to conquer dust. Dust accumulation has traditionally posed operational risks and decreased performance in electronic devices. The new AirJet Mini Slim tackles this concern with its self-cleaning function that automatically reverses airflow and clears any accumulated dust from the AirJet dust filters.This ensures sustained peak performance of AirJet over the long term and maintains the high performance of the host device. This intelligent self-cleaning feature is backward compatible and is also available with the AirJet Mini.
Thermoception:
TheAirJet Mini Slim introduces Thermoception, a capability that enables AirJet to independently sense its temperature. This innovation allows the AirJet MiniSlim to optimize its performance autonomously, maximizing heat removal without relying on temperature sensors in the host device, opening new possibilities for cooling devices that lack integrated CPUs and temperature sensing components.
OurFounder and CEO, Seshu Madhavapeddy, said, "Reducing the chip's thickness by 0.3mm is a game-changer for products requiring excellent thermal management in increasingly thinner devices. AirJet Mini Slim will bring much-needed performance improvements to ultra-thin electronic devices like fanless laptops, tablets, and smartphones."
Since launching AirJet in January 2023, we have been delighted at the unprecedented demand for our small, highly effective active cooling chips. Our latest product, AirJet Mini Slim with its new intelligent capabilities, is just 2.5mm thick and 8g, 0.3mm thinner and 1g lighter than the original AirJet Mini, while retaining the same tiny footprint, just 27.5mm x 41.5mm. Like all of our products, AirJet Mini Slim is a scalable solution, with additional heat removal achievable by simply adding more AirJet chips. Each chip removes 5W of heat, and the easy integration of multiple chips means two chips can remove 10W, three chips 15W and so on.
AirJet’s compact size and scalable nature means manufacturers can achieve enhanced heat removal for increased performance in a wide range of faster, thinner, lighter, silent, and dustproof devices. AirJet can enhance performance across numerous devices from Notebooks, Mini-PCs, tablets, smartphones and SSDs to the approaching tsunami of IOT devices; DSLR cameras, WiFi access points and LED lighting, and in markets as diverse as the datacenter and automotive industries.
