The AirJet PAK integrates multiple AirJet, the world’s first solid-state active cooling chip, to remove the increasing heat generated by intense AI workloads.  Removing this heat unleashes the AI performance needed for Edge AI in key markets including autonomous vehicles, robotics, industrial automation, smart cities, healthcare, and retail analytics.

AirJetPAKs are a fully integrated, self-contained, plug and play active cooling solution that are as thin as 6.5mm and can be easily added to a host device to enable the performance needed to perform AI workloads at the Edge in smaller, silent, lighter, vibration free, water resistant, and dust free, compact devices. 

The need for improved cooling to enable AI is increasing rapidly, and with a forecast of demand for Edge AI Computing estimated to increase by over 300% by 2030, it will not slow down anytime soon. 

‍Heat, which limits performance, is now the single biggest problem facing the computing industry. AirJet’s ability to dissipate heat, unleashing performance, is essential for AI applications.

AirJet PAK is available in a range of sizes designed for easy integration into enclosures containing System on Modules (SoMs) for example the NVIDIA Jetson Nano, NX, AGX, Qualcomm and the AMD Versal (see Applications Section for further details) .

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The AirJet PAK generates 1750 Pascals of back pressure, ensuring effective air flow into and out of the cartridge, even when the air vents are covered with IP53 dust proof filters.

This, together with the AirJet PAKs intelligent even when the air vents are covered with IP53 dust proof filters ensuring the sustained thermal performance of the AirJet PAK and as a result, the sustained high performance of the dust free host device.

Driven autonomously, the AirJet PAK can independently sense the surrounding temperature using Thermoception, an innovation that allows the AirJet PAK to optimize its performance, maximizing heat removal without relying on temperature sensors in the host device. All the AirJet PAK needs to enable exceptional processor performance is a nominal power source from the host device.

Power Heat Removal
AirJet PAK 5C-G removes net 45 W of heat at a silent 29 dBA, while consuming a maximum of 7.5 W of power, when integrated into an industrial compute platform at 25ºC ambient, outperforming fans in compact Edge AI devices.

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In today’s devices, what often determines performance is the capability of the thermal solution, not just the sophistication of the processor.

Thanks to AirJet PAK, compact Edge AI electronic devices can now deliver on the promise of cutting-edge AI technology. Do more.‍