Frore Systems AirJet®, is the world’s first solid-state chip for active device cooling and it is rapidly changing the electronics industry.
AirJet removes heat from electronic devices with breakthrough technology that meets the ever-increasing demands of today’s consumers, delivering up to 3x improvement in performance, while operating in silence.
Heat is the single biggest problem facing the computing industry. The processor, the brain of any device, generates more heat the faster it operates. Until now, manufacturers have used antiquated thermal solutions like mechanical fans in notebooks, tablets, and other consumer devices to remove heat. These inadequate thermal solutions are causing the devices to overheat. To combat this, manufacturers use throttling, a fail-safe functionality that prevents overheating by slowing down the processor after only a few seconds of operation. This means consumers never really get the full processor performance they pay for.
Since AirJet Mini was launched, in January 2023, Frore Systems has experienced unprecedented demand for their small, highly effective active cooling chip. The AirJet Mini is just 2.8mm thick, 27.5mm x 41.5mm in size, and weighs only 9 grams. AirJet is a scalable solution, with additional heat removal achievable by simply adding more AirJet chips. Each chip removes 5W of heat, and the easy integration of multiple chips means two chips can remove 10W, three chips 15W and so on. AirJet’s compact size and scalable nature means manufacturers can adopt the heat removal technology in a wide range of applications, enabling increased performance in faster, thinner, lighter, silent, and dustproof devices.
Electronics manufacturers are excited.
Consumers are demanding smaller and smaller devices, but also the high performance available with the latest technology. This has been a real struggle for manufacturers who have been trying to deliver the increased performance customers demand, despite heat limitations. With AirJet, manufacturers can finally deliver higher performance in compact packages – so they are enthusiastically embracing AirJet.
Increasing laptop performance with Intel:
“Intel’s mission with Intel Evo is to unite the open PC ecosystem to deliver the best possible laptop experiences that people want. Engineering thin, light, stylish laptop designs that offer great performance while remaining cool and quiet are foundational to that mission. Frore Systems’ AirJet technology offers a new and novel approach to help achieve these design goals in new ways and Intel is excited about the engineering collaboration with Frore Systems to help ready their technology for future Intel Evo laptops.” Said Josh Newman, VP & GM Mobile Platforms at Intel.
The world’s first high performance, dustproof Mini PC with Zotac:
“At ZOTAC, we strongly believe that innovation is not only about improving, but rather doing something in completely new ways, which is exactly what the AirJet® offers us.” said Tony Wong, Chief Executive Officer at ZOTAC Technology. “The new AirJet® powered ZBOX PI430AJ delivers superior performance in a silent, miniaturized form, and we’re proud that this solid-state actively cooled mini-PC will be a trailblazer in the industry with its breakthrough cooling solution.”
The first high performance compact 64TB: storage device with OWC:
"It is very exciting to see the application and benefits for our solutions that the Frore Airjet system presents. I look forward to taking our solutions further and farther in partnership with Frore.” said Larry O’Conner, CEO of OWC. “The many ways this technology allows us to increase capacity, long term level up design, improve customer experience and application suitability has opportunities that are endless.”
Record breaking 3x Speed Performance in 8TB Compact SSD accessories with Sabrent:
“We are excited to work with Frore Systems to enable exciting new storage technology advances," said William Harmon, Chief Technology Officer of Sabrent. "Frore Systems AirJet technology will allow Sabrent to create more compact portable storage designs so we can give users more data capacity in a smaller enclosure.”
The Worlds fastest PCIe Gen5 SSD for Gaming with Phison:
“Phison is ecstatic to be showcasing product performance milestones for the industry, our partners and customers because we are committed and dedicated to engineering next generation technologies through ecosystem excellence,” said Michael Wu, GM & President of Phison Technology Inc. (USA). “Leveraging AirJet, a truly groundbreaking innovation in thermal solutions, we are continuing our legacy of leaning into technology that can bring enhanced experiences to market.”
Industry experts and thought leaders are also excited about AirJet:
Patrick Moorhead, Industry expert and CEO and Chief Analyst at Moor Insights & Strategy
“Heat is by far the biggest hurdle we need to overcome in computing. Thermally stressed hardware doesn’t perform optimally, and current thermal solutions fall short. I believe Frore Systems has reinvented thermal technology with its AirJet chip that doubles active heat removal with a thinner, silent solution that provides greater performance.”
Linus Sebastian, Linus Tech Tips
“This thing hauls butt, they are blowing air at over 200kms an hour through those filters and blasting it onto the copper plate... they’ve used these jets of super high velocity, high pressure air to completely obliterate the boundary layer. This increases effective heat dissipation by about five times for the same airflow and functionally saturates the air with heat.”
Gordon Ung, PC WORLD
“AirJet Mini… is really revolutionary stuff. Basically the biggest change since fans were invented, I don’t know, a couple of hundred years ago.”
Navin Chaddha, Managing Director at Mayfield
"Frore leverages the Renaissance of Semiconductors trend to put silicon back into Silicon Valley. Seshu and Surya are world-class entrepreneurs and technologists whom we partnered with at inception in 2018. It’s exciting to watch them deliver breakthrough products that solve cooling - one of computing’s biggest problems.”
AirJet, the world’s first solid state active cooling chip, is revolutionizing heat removal and transforming device performance. It virtually eliminates the need for throttling, increasing processor performance up to 3x, while making devices cooler to touch.
AirJet’s compact size, just 2.8mm thick, 27.5mm x 41.5mm in size, and light weight, under 11 grams, means AirJet can remove heat from devices that have previously been unable to use active cooling. Devices like ultra-thin laptops, Mini PCs and SSDs, that have needed to reduce performance, relying on antiquated thermal approaches like throttling, noisy mechanical fans or bulky ineffective heat sinks to remove heat generated by the ever-increasing workloads consumers’ place on their devices.
AirJet is a scalable solution, with additional heat removal – and increased performance - achievable by simply adding more AirJet chips. Each chip removes 5W of heat, and the easy integration of multiple chips means two chips can remove 10W, three chips 15W and so on. AirJet’s compact size and scalable nature means manufacturers can adopt the heat removal technology in a wide range of applications, enabling increased performance in faster, thinner, lighter, silent, and dustproof devices.
