ZOTAC’s ZBOX PI430AJ with AirJet® features the revolutionary solid-state cooling chip from Frore Systems. Using AirJet, this trailblazing Mini PC has doubled its performance and includes an array of features previously only available in larger systems - finally giving customers what they need in a compact form.
The world’s first Mini PC powered by two of Frore System’s AirJet Mini Solid-State Active Cooling Chips, boasts significantly higher performance and a list of impressive upgrades, including an Intel® Core™ i3 processor, 8 GB of LPDDR5 memory, a M.2 SSD storage slot and more – all within a system the size of a deck of cards. Before AirJet, upgrades like this were inconceivable in such a small system, because the compact devices were severely constrained by heat. The AirJet Mini chips remove 10W of additional heat from the tiny device, creating the opportunity for the ZOTAC Mini PC to do more than was ever thought possible.
Available directly from ZOTAC Technology, the Mini PC is just 114.8mm x 76mm x 23.8 mm in size. The additional heat generated by all the hardware upgrades is removed by the two AirJet Mini chips, enabling full sustained processor performance of 7W TDP. With all its new features, the ZOTAC ZBOX PI430AJ with AirJet® is the most innovative, powerful and ‘coolest’ device in its class.
“At ZOTAC, we strongly believe that innovation is not only about improving, but rather doing something in completely new ways, which is exactly what the AirJet® offers us.” said Tony Wong, Chief Executive Officer at ZOTAC Technology. “The new AirJet® powered ZBOX PI430AJ delivers superior performance in a silent, miniaturized form, and we’re proud that this solid-state actively cooled mini-PC is a trailblazer in the industry with its breakthrough cooling solution.”
These upgrades are so impressive in such a small device because it has never been possible before. Increased performance and capability mean more heat, and compact Mini PCs have always been too small to remove enough heat with passive cooling like heat sinks and pipes. They are also too small for fans, which have the additional disadvantage of sucking dust into the system along with the cool air needed to reduce temperatures, which overtime makes the fans fail.
But now AirJet makes advanced heat removal in really small devices possible, and consumers have the option of upgrading to a more capable hardware configuration, why is that a good idea? The ZOTAC ZBOX PI430AJ with AirJet® will make a massive difference to your Mini PC experience.
SILENT PERFORMER
With no fans and other moving parts, the PI430AJ’s active cooling module operates silently. Yet the more capable cooling capacity pushes performance to higher levels with a more robust CPU with longer sustained performance.
LONGEVITY
The solid-state design of AirJet means that there are no moving parts to wear and tear, further increasing its stability, reliability, and robustness. The design is also dustproof to sustain its operation in harsher environments.
CONNECTIVITY
Although small, the ZBOX PI430AJ with AirJet has a well-rounded selection of connectivity options for peripheral needs. This includes a USB Type-C port and two USB 3.2 Type-A ports, HDMI and DisplayPort display outputs, as well as a full-sized Gigabit LAN port as well as Bluetooth 5.2 and WiFi 6 wireless connectivity options.
AWARD-WINNING DESIGN
The redesign of the ZBOX pico Series as featured on the ZBOX PI430AJ with AirJet, has also had the honor of winning the Good Design Award 2023, Japan’s premier design award for a revolutionary product like no other. The Good Design Award (Japanese: グッドデザイン賞) is an award sponsored by the Japan Institute of Design Promotion, which is given to things with excellent design every year. It is the only comprehensive evaluation and recommendation system of design in Japan. The Good Design Award Judges commented “This mini PC achieved the world’s first completely fanless design by adopting the cooling chip called “AirJet” by Frore Systems.… this product had no errors nor heating up while playing consecutive promotion movies during the second screening, and succeeded to prove the capability of its cooling chip.”
The ZOTAC ZBOX PI430AJ is clearly in a class of its own, but why hasn’t this been done before? In short, the answer is heat!
The average consumer is unaware that heat prevents most electronic devices from performing at their advertused potential. This applies to products ranging from laptops and Mini PC’s to gaming devices and smart phones.
Heat is the single biggest problem facing the electronics industry. Until now, manufacturers have been forced to rely on antiquated thermal approaches like noisy mechanical fans or bulky ineffective heat sinks to remove heat generated by the ever-increasing workloads consumers’ place on their devices. These dated and inadequate thermal approaches cause systems to rapidly overheat, forcing reduced performance, throtling after only a few seconds of operation. As a result, consumers never really get the full performance they expect and pay for.
“The ZOTAC ZBOX PI430AJ with AirJet® has revolutionized the Mini PC industry,” said Dr. Seshu Madhavapeddy, founder and CEO of Frore Systems. “Until AirJet, thermal was the only aspect of modern-day technology that hadn’t changed in decades. ZOTAC’s fanless Mini-PC with AirJet, with the world’s highest performing mobile CPU and 8 GB of LPDDR5 memory upgrade, is a game changer. Consumers can now get the high performance Mini-PC they want, in an incredibly small, silent, cool and fanless device.”
Frore Systems launched the AirJet Mini in January 2023 and has seen unprecedented demand for the small, highly effective active cooling chip. The AirJet Mini is just 2.8mm thick, 27.5mm x 41.5mm in size, and weighs only 9 grams. AirJet is a scalable solution, with additional heat removal achievable by simply adding more AirJet chips. Each chip removes 5W of heat, and the easy integration of multiple chips means two chips can remove 10W, three chips 15W and so on. AirJet’s compact size and scalable nature means manufacturers can adopt the heat removal technology in a wide range of applications, enabling increased performance in faster, thinner, lighter, silent, and dustproof devices.
