LiquidJet DIAMOND is a 3D ultra short-loop multi-stage coldplate with integrated Diamond spreader. Designed to achieve over 150% higher performance than traditional skived coldplates, LiquidJet DIAMOND’s innovative multi-stage architecture delivers 75% higher heat transfer efficiency. It enables the entire flow to be concentrated to first cool the hotspots, before cooling the other areas of the GPU die, HBMs and other chiplets in the SoC. LiquidJet DIAMOND supports hotspot cooling up to 770 W/cm2 for a 5 mm x 5 mm hotspot @ 25 ºC inlet temperature, 95 ºC TJmax with PTM7950 TIM in an unlidded package, exceeding the requirements of future GPUs: Rubin Ultra, Feynman, MI455, MI500, and custom hyperscaler ASICs.
3D MICROSTRUCTURE CORE WITH INTEGRATED DIAMOND:
Frore Systems takes a unique approach to LiquidJet coldplate manufacturing, adapting semiconductor processes to metal wafers, fabricating multi-stage cooling architecture with innovative 3D ultra short-loops, that are designed precisely to the power maps of data center GPUs. Diamond is embedded in the bottom surface of the coldplate, placed directly above the hotspots.
Liquidjet Diamond Performance Compared to Multi-Inlet Skived:
Specifications:
LiquidJet DIAMOND dimensions shown are customized to the target GPU.
Measurements for NVIDIA GB300:
Length: 104.6 mm
Width: 62 mm
Height: 20.4 mm
Material: Copper, Diamond
LiquidJet DIAMOND is the most advanced DLC coldplate for high power density hotspots.
Contact Frore Systems today to discover how LiquidJet DIAMOND can transform and future proof your operations with an easy drop-in upgrade to your data center racks.
