SAN JOSE, California – January 2, 2026 – As NVIDIA continues to push edge AI performance forward, thermal limits are increasingly the primary constraint on system capability. Frore Systems today announced AirJet®PAK 5C-G2, its next-generation solid-state active cooling plug and play module designed to unlock sustained performance for advanced AI Systems. AirJet PAK is the world’s first solid-state active cooling solution designed to complement a wide range of edge AISoMs, including NVIDIA’s Jetson Orin Nano, Nano Super, NX Super & Orin AGX modules, as well as SoMs from Qualcomm, AMD/Xilinx, and more. The AirJet PAK can be directly mounted on the SoM, removing heat and unleashing full Edge AI performance.
AirJet®PAK 5C-G2 will be demonstrated live at CES, showcasing sustained AI performance on the NVIDIA® Jetson Orin™ NX Super.
NVIDIA’s Jetson Orin NX Super delivers significantly higher AI throughput for demanding edge workloads such as robotics, machine vision, and real-time analytics. But without adequate cooling, that performance cannot be sustained. Passive heat sinks quickly reach thermal limits, while fan-based solutions introduce noise, reliability risks, and environmental vulnerabilities. AirJet®PAK 5C-G2 removes these constraints.
Designed to Keep Up with NVIDIA’s Edge AI Roadmap
AirJet®PAK 5C-G2 is a fully self-contained, plug-and-play solid-state active cooling module that delivers up to 45 W of net heat dissipation, enabling Jetson Orin NX Super platforms to maintain peak performance under continuous workloads.
Each AirJet®PAK 5C-G2 integrates five AirJet®Mini G2 solid-state cooling chips — the same next generation AirJet architecture that earned Frore Systems its third consecutive CES Innovation Award — delivering higher thermal headroom in a compact, production-ready module.
Designed to mount directly on AI SoMs, AirJet®PAK 5C-G2 enables edge platforms to operate reliably even in compact, light, silent, vibration-free, dustproof, and water-resistant enclosures.
Why Sustained Performance Matters at the Edge
Industrial edge AI systems run continuous workloads, not short bursts. Applications such as robotics, vision processing, and real-time sensor analytics must operate reliably for extended periods — often in harsh or space-constrained environments.
Without advanced cooling, these systems are forced to throttle, reducing throughput and undermining the value of AI acceleration. The AirJet®PAK 5C-G2 ensures NVIDIA Jetson Orin NX Super systems can deliver consistent, sustained AI performance where it matters most — in real world applications.
AirJet®PAK 5C-G2 combines multiple AirJet Mini G2 chips into a single autonomous active heat-sink module designed for high-performance edge AI.
Key capabilities include:
- Net heat dissipation: 45 W
- Supported AI performance: up to 185 TOPS on NVIDIA Jetson platforms
- Back pressure: 1,750 Pa, enabling airflow through dustproof and water-resistant filters
- Noise level: 27? dBA, enabling silent operation
- Form factor: 100 × 65 × 10 mm, supporting ultra-compact systems
- Weight: just 101 g, supporting light weight systems
Multiple AirJet®PAK modules can be combined to support higher-power edge platforms, enabling scalable cooling as AI workloads continue to grow.
Enabling Smaller, Lighter, More Reliable Edge AI Systems
Compared to large passive heat sinks or fan-based cooling solutions, systems using AirJet®PAK 5C-G2 can be:
- Significantly smaller and lighter
- Protected against dust and water
- Quieter and more reliable than fans over long operational lifetimes
These attributes are increasingly critical as edge AI expands into factories, transportation systems, smart infrastructure, healthcare, and other mission-critical environments.
“NVIDIA continues to raise the bar for edge AI performance, and cooling has to evolve just as fast,” said Seshu Madhavapeddy, CEO and Founder of Frore Systems. “AirJet®PAK 5C-G2 builds on the same AirJet Mini G2 technology recognized with a CES Innovation Award, enabling Jetson Orin NX Super systems to sustain high performance without the compromises of fans or bulky heatsinks.”
Live Demonstrations at CES 2026: Frore Systems will demonstrate Edge AI devices with AirJet and Airjet PAK solid-state active air cooling featuring Industrial Edge IoT platforms and consumer products, and Qualcomm Snapdragon X2 Elite compute reference platforms. Additional demonstrations include LiquidJet live at CES 2026, showcasing: LiquidJet coldplate performance for cooling 1,950W NVIDIA Rubin, 600W/cm² extreme hotspot cooling, and single-reticle 1,200W ASIC cooling.
Experience the future of AI performance in the Frore Systems Demonstration Room, January 6–9, Venetian Expo, Level 2, Room 2401B, Las Vegas.
About Frore Systems
Frore Systems is a pioneer in advanced thermal technologies that unleash performance across data centers and edge devices. The company’s flagship solutions include LiquidJet™, a multi-stage 3D shortloop jetchannel liquid cooling coldplate for data centers delivering higher GPU performance, improved PUE and reduced TCO; and AirJet®, the world’s first solid-state active cooling chip used in consumer, industrial, and IoT markets delivering higher performance in ultra-compact, silent, light, dustproof and water-resistant edge devices. Frore’s patented cooling technologies are integrated into products from major OEMs and system builders worldwide. Frore Systems is headquartered in Silicon Valley, with manufacturing operations in Taiwan.
Media Contact:
Sue Ryan - VP Marketing Frore Systems
sue@froresystems.com
Cell +1 314 914 5008
