Designed to futureproof data centers

Featuring a highly customizable design that can match your SoC power map, LiquidJet’s unique 3D short-loop jet channels remove 50% more heat and support 2x higher hotspot power density.

Created using semiconductor manufacturing processes adapted to metal wafers, LiquidJet features a groundbreaking design unlocking higher  performance in the powerful GPUs of today and tomorrow.

Works where fans can’t

Traditional fans need space, large air vents, and moving parts — making them impossible to use in the thinnest, quietest, or most rugged devices.

AirJet^® breaks that barrier. Our solid-state active cooling works silently inside ultra-slim, silent, dustproof, water-resistant, and compact designs where fans simply can't survive.

Performs when passive cooling isn’t enough‍

Passive cooling can only take you so far. As devices get more power-dense, heat spreaders and heat sinks alone can’t keep up.

AirJet^® steps in — delivering active, high-performance cooling without noise or moving parts. Smaller devices. Bigger possibilities.