Breaking News
Qualcomm Snapdragon X2 Elite Reference Platforms Integrate Frore Systems AirJet Mini G2
Available now
ZBOX PI430AJ with AirJet®
The world’s first solid-state active cooled Mini PC.

A revolution in cooling technology
for high performance applications

Data Center

Designed to futureproof data centers

Featuring a highly customizable design that can match your SoC power map, LiquidJet’s unique 3D short-loop jet channels remove 50% more heat and support 2x higher hotspot power density.

Created using semiconductor manufacturing processes adapted to metal wafers, LiquidJet features a groundbreaking design unlocking higher  performance in the powerful GPUs of today and tomorrow.

Industrial Embedded

Works where fans can’t

Traditional fans need space, large air vents, and moving parts — making them impossible to use in the thinnest, quietest, or most rugged devices.

AirJet® breaks that barrier. Our solid-state active cooling works silently inside ultra-slim, silent, dustproof, water-resistant, and compact designs where fans simply can't survive.

Consumer Devices

Performs when passive cooling isn’t enough

Passive cooling can only take you so far. As devices get more power-dense, heat spreaders and heat sinks alone can’t keep up.

AirJet® steps in — delivering active, high-performance cooling without noise or moving parts. Smaller devices. Bigger possibilities.

Introducing the LiquidJetTM Coldplate:

A Direct-to-Chip Liquid Cooling 3D Coldplate with 50% higher KW/lpm and supporting 600 W/cm2 hotspot cooling

Breakthrough solid-state active cooling technology for industrial embedded and consumer devices

Faster
Silent
Ultra Thin
Lighter
Dust Proof
Water Resistant
Vibration-Free

AirJet® isn’t just a replacement for fans—
it's a new class of active cooling, designed for the next generation of devices.

Why Frore?

We Didn't Just Improve Cooling.
We Reimagined It.

Breakthrough coldplate design for AI Factories | Data Centers

2X Higher hotspot Power Density
50% Higher KW/LPM
4X Lower pressure drop
Customized to match any SOC power map
Easy Drop-in upgrade
Lower data center TCO
Improved data center PUE

LiquidJet is changing the Direct-to-chip Liquid Cooling coldplate industry -
Bringing semiconductor manufacturing processes to coldplate design and unleashing GPU performance

Powering innovation across industries

20+ brands integrating Frore Systems Cooling Solutions into high performance devices now.

More major announcements coming soon!

Awards & Recognition for AirJet®

PC Mag - Best in Show CES 2023Hot Hardware - Best of CES 2023Best Choice Award - Computex 2023 Golden AwardPC World - Best of Computex 2023WCCF Tech - Best of Computex 2023Flash Memory Summit - Best of ShowGood Design AwardInnovation Awards CES 2025 Honoree

As seen on

PCMag.com
tom's Hardware
IGN
Linus Tech Tips
XFastest
TweakTown
PC World
TechRadar
engadget
Tech Power Up

What's inside is genuinely innovative…

Brian Westover
PCMAG

A massive performance uplift

Linus Tech Tips

The latest Zotac mini PC might just be the coolest yet

John Burek
PCMAG
2025
October
LiquidJet Launched
2025
August
AirJet Mini G2 mass production
2024
December
AirJet PAK mass production
2023
September
AirJet Mini Slim mass production
Milestone

Technology in Motion

And this is just the beginning.
Here’s how Frore Systems has transformed cooling:

Intel
Phison
Qualcomm
Zotac
iodyne
nvidia
AMD
Intel
Phison
Qualcomm
Zotac
iodyne
nvidia
AMD
Intel
Phison
Qualcomm
Zotac
iodyne
nvidia
AMD
Thermally stressed hardware doesn’t perform optimally, and current thermal solutions fall short. I believe Frore Systems has reinvented thermal technology with its AirJet chip that doubles active heat removal with a thinner, silent solution that provides greater performance."
Moor Insights & Strategy
Patrick Moorhead
Industry expert and CEO and Chief Analyst at Moor Insights & Strategy
Frore Systems’ AirJet technology offers a new and novel approach to help achieve thin, light, stylish laptop designs that offer great performance while remaining cool and quiet. Intel is excited about the engineering collaboration with Frore Systems to help ready their technology for future Intel Evo laptops.”
Intel
Josh Newman
VP & GM Mobile Platforms at Intel
Michael Wu
Phison is ecstatic to be showcasing product performance milestones for the industry, our partners and customers because we are committed and dedicated to engineering next generation technologies through ecosystem excellence.  Leveraging AirJet, a truly groundbreaking innovation in thermal solutions, we are continuing our legacy of leaning into technology that can bring enhanced experiences to market
Phison
Michael Wu
GM & President of Phison Technology Inc. (USA)